PRECISION
PCBA
AT GLOBAL
SCALE.

IPC Class III certified manufacturing and AI-augmented design engineering. From first prototype to mass production — uncompromising quality at every volume.

CertifiedIPC Class IIIISO 9001AS9100DIATF 16949RoHS
CORGENTAI-7900X · Rev 4DDR532GB ECCNVMePCIe 5.0FPGAXC7A200TPMUMulti-rail
50M+
PCBs Assembled
99.8%
First-Pass Yield
10×
Faster AI Design
24hr
Prototype Turnaround
SMT Assembly
BGA Solutions
IPC Class III
AI Design Agent
ISO 9001:2015
AS9100D Certified
01005 Components
32-Layer PCB
AOI + 3D X-Ray
24hr Prototype
RoHS Compliant
In-Circuit Testing
Signal Integrity AI
DFM Analysis
IATF 16949
SMT Assembly
BGA Solutions
IPC Class III
AI Design Agent
ISO 9001:2015
AS9100D Certified
01005 Components
32-Layer PCB
AOI + 3D X-Ray
24hr Prototype
RoHS Compliant
In-Circuit Testing
Signal Integrity AI
DFM Analysis
IATF 16949

End-to-End
Manufacturing Solutions

Four integrated disciplines — one seamless pipeline from design through verified production.

01Manufacturing

Precision PCBA Manufacturing

Full-spectrum PCB assembly under IPC Class III standards with AI-assisted process control. From bare board to finished product — SMT, THT, BGA, and mixed-technology lines operating at maximum precision.

  • SMT & Through-Hole Assembly
  • BGA / QFN / Fine-Pitch (01005)
  • AOI + 3D X-Ray Inspection
  • 24hr Prototype · Mass Production
Learn More
CORGENTMCU · 256KBDDR5FLASHPWR
02Design

Electronic Design Services

End-to-end hardware engineering from system architecture through schematic capture, multi-layer PCB layout, signal integrity analysis, and DFM verification — delivered by senior engineers.

  • Schematic Capture & Review
  • 1–32 Layer PCB Layout
  • Signal & Power Integrity
  • DFM / DFA Analysis
Learn More
R1R2C1AMPC2VCCP1P2P3P4P5
03AI Platform

Corgent AI Design Platform

Proprietary AI platform trained on millions of real electronics designs. Autonomous schematic generation, component selection, layout optimization, and DRC — delivering engineering-ready outputs 10× faster.

  • Autonomous Schematic Generation
  • Intelligent BOM Optimization
  • AI-Driven Layout & Routing
  • Real-time DRC / ERC Validation
Learn More
CORGENT AI PROCESSING ENGINEINPUTDesign SpecsReference Sch.ConstraintsCost TargetsVolume GoalsAI ENGINESchematic Gen.Component Sel.PCB LayoutDFM CheckSI AnalysisBOM OptimizeOUTPUTGerber FilesBill of MatlsAssembly Drw.Test SpecQuality Rpt
04Quality

Quality Assurance & Testing

Multi-stage verification pipeline covering AOI, 3D X-ray inspection, in-circuit testing, and functional validation. AI vision detects micro-defects invisible to traditional inspection — every board, every time.

  • Automated Optical Inspection
  • 3D X-Ray (AXI) Inspection
  • In-Circuit Testing (ICT)
  • Functional & Environmental Test
Learn More
AOI INSPECTION SYSTEM● PASSMCU✓ OKTEST RESULTSSolder JointPASSComponent IDPASSPolarityPASSBridge TestPASSMissing PartsPASSTombstoneN/A1,248Inspected2Defects99.8%YieldIPC-A-610Class IIIISO 9001
INDUSTRIES SERVED

Built for the World's Most Demanding Applications

From single-unit prototypes to million-piece production runs — across the industries where failure is not an option.

Aerospace & Defense

Flight-critical assemblies, avionics, and weapons-system electronics built to MIL-SPEC and AS9100D requirements with full ITAR compliance.

AS9100D · ITAR

Medical Devices

Class II & III medical electronics with full component traceability, documented risk management, and sterilization-compatible materials.

ISO 13485 · FDA 21 CFR

Automotive Electronics

ECUs, ADAS modules, and EV battery management systems assembled to AEC-Q100 component grades and IATF 16949 process quality.

IATF 16949 · AEC-Q100

Industrial IoT

Rugged embedded systems, edge computing hardware, and smart sensor arrays engineered for harsh industrial environments and 24/7 uptime.

IEC 61508 · IPC Class III

5G & Telecom

High-frequency RF PCBAs, mmWave antenna arrays, and base station hardware using advanced laminates and precision fine-pitch assembly.

IPC Class III · REACH

Consumer Electronics

High-volume consumer products with DFM-optimized layouts, rapid NPI cycles, and multi-region compliance certification management.

RoHS · REACH · CE · FCC

Corgent AI Platform
From Specification to Silicon in Hours

Purpose-built on millions of real PCB designs and manufacturing outcomes. The Corgent AI Platform autonomously executes complete design workflows — delivering production-ready packages 10× faster than traditional methods.

Autonomous Schematic Generation
Natural language requirements → validated schematics in under an hour.
Intelligent Component Selection
Real-time BOM optimization across 50M+ parts database with lifecycle checks.
AI-Driven PCB Layout
Automated placement and routing respecting SI, thermal and DFM rules.
Design for Manufacturability
Instant DFM analysis catches issues before they enter production.
Signal Integrity Analysis
AI-powered SI/PI with impedance verification and decoupling guidance.
Continuous Learning Pipeline
Every assembled board refines model accuracy across the platform.
Corgent AI Design Platform — Active
INAIOUT
Project: RF Power Amplifier · Rev 3.1● PROCESSING
01Input
Design specifications
Reference schematics
Component constraints
Target cost & volume
AIEngine
Schematic synthesis
Component selection
PCB layout & routing
DFM / DRC validation
SI / PI analysis
running...
OUTDeliverables
Production Gerbers
Optimized BOM
Assembly drawings
Test specification
PCB Layout 68% complete · Est. 1h 24m remaining47 components placed
Design Time4.2 hrs avg
DRC Accuracy98.6%
Cost SavingUp to 31%
10×
Faster than traditional design
98.6%
DRC first-pass accuracy
50M+
Components in AI knowledge base
<4hr
Average time-to-Gerbers

World-Class Production Capabilities

State-of-the-art equipment paired with rigorous AI-assisted process control — from prototype to mass production without compromise.

SMT Assembly
High-speed Fuji NXT lines
BGA Rework
Precision BGA reballing
X-Ray Inspection
3D real-time AXI
AOI
6-axis optical scan
Conformal Coating
Selective parylene/acrylic
ICT Testing
Flying probe & bed-of-nails
Functional Testing
Custom JTAG & boundary-scan
Box Build
Enclosure integration & cabling
TECHNICAL SPECIFICATIONS
Assembly TechnologiesSMT · THT · Mixed · BGA · SiP
Component Package Size01005 (0.4mm × 0.2mm)
Max Board Dimensions610mm × 460mm
PCB Layer Count1 – 32 Layers
Min Trace / Space50μm / 50μm
Min Drill Size0.1mm Laser / 0.2mm Mech.
Surface FinishHASL · ENIG · OSP · Imm Ag/Sn
Solder PasteSn63Pb37 · SAC305 · Lead-Free
Prototype Turnaround24hr / 48hr / 5-Day
Production Volume1 – 1,000,000+ Units/Month
Reflow Profiles8-Zone Nitrogen Reflow
Selective SolderLaser-controlled Selective Wave
IPC-A-610 Class IIIISO 9001:2015IATF 16949AS9100DRoHS / REACHUL Registered

From Idea to Production
in Record Time

AI automation compresses every stage of the product development lifecycle — slashing time-to-market without sacrificing quality.

STEP 01

AI Design Brief

Submit requirements in natural language. Our AI ingests specs, constraints, and target cost to model your intent.

STEP 02

Autonomous Design

Corgent AI generates schematics, selects components, routes PCB, runs DRC/DFM — hours, not weeks.

STEP 03

Engineering Review

Senior engineers validate AI outputs against IPC standards and client requirements with AI-assisted review tools.

STEP 04

Precision Assembly

Verified Gerbers enter AI-scheduled production lines. Automated kitting, optimized reflow profiling, real-time control.

STEP 05

Multi-Stage QC

Every board passes AOI, 3D X-ray, ICT, and functional test. AI vision flags micro-defects invisible to humans.

Hours → Days
Design Phase
1–2 Days
Engineering Review
24hr Prototype
PCBA Production
Same Day
Test & Verify
Door-to-Door
Delivery

THE GLOBAL STANDARD
FOR ADVANCED ELECTRONICS

Decades of manufacturing excellence, powered by proprietary AI — delivering quality, precision, and speed that traditional PCBA manufacturers cannot match.

0M+
PCBs Assembled
Since founding
0.0%
First-Pass Yield
Industry avg: 96%
0×
Faster Design
vs. traditional
0hr
Prototype Turnaround
Guaranteed

AI-Augmented Engineering

Purpose-trained on millions of real electronics designs — not adapted from generic LLMs. Domain-specific intelligence that genuinely understands circuit design and manufacturing.

Uncompromising Quality

IPC Class III, AS9100D aerospace certification, and zero-defect manufacturing culture — from paste printing to final functional test, on every single board.

Unlimited Scalability

Single-unit prototypes to million-piece production runs on the same validated platform. No re-qualification, no re-engineering — the same quality at every volume.

Full Vertical Integration

Design, BOM sourcing, fabrication, assembly, and test under one roof. Complete supply-chain visibility and accountability on every board we produce.

START YOUR PROJECT

From Concept to Certified Hardware.
In Record Time.

Share your requirements with our engineering team and receive a detailed proposal — including BOM, timeline, and pricing — within 24 hours.

IPC Class III
ISO 9001:2015
AS9100D
IATF 16949
RoHS Compliant